JPS6311733Y2 - - Google Patents
Info
- Publication number
- JPS6311733Y2 JPS6311733Y2 JP5047283U JP5047283U JPS6311733Y2 JP S6311733 Y2 JPS6311733 Y2 JP S6311733Y2 JP 5047283 U JP5047283 U JP 5047283U JP 5047283 U JP5047283 U JP 5047283U JP S6311733 Y2 JPS6311733 Y2 JP S6311733Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- integrated circuit
- filling frame
- filled
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- 238000007789 sealing Methods 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5047283U JPS59155741U (ja) | 1983-04-04 | 1983-04-04 | 混成集積回路の封止構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5047283U JPS59155741U (ja) | 1983-04-04 | 1983-04-04 | 混成集積回路の封止構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59155741U JPS59155741U (ja) | 1984-10-19 |
| JPS6311733Y2 true JPS6311733Y2 (en]) | 1988-04-05 |
Family
ID=30180930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5047283U Granted JPS59155741U (ja) | 1983-04-04 | 1983-04-04 | 混成集積回路の封止構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59155741U (en]) |
-
1983
- 1983-04-04 JP JP5047283U patent/JPS59155741U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59155741U (ja) | 1984-10-19 |
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